New mixed signal connector from ITT Interconnect

20 FEBRUARY 2009

A new mixed signal connector developed by leading hi-rel connector company ITT Interconnect Solutions provides a complete turnkey solution to the problem of carrying high and low voltage signals in the same interconnect package. The Mixed Signal HV MDM connector is a new addition to ITT’s highly successful MDM micro series of high density connectors suitable for harsh environments, particularly aerospace applications. A high-voltage contact system with isolation towers and specialised silicone sealing has been integrated into the connector to accommodate multiple voltage outputs and the use of advanced materials prevents electrical arcing between contacts in high altitude conditions.
The turnkey interconnect configuration of the mixed signal MDM connector features high voltage contacts capable of carrying up to 2000VDC, while ITT’s twist pin contact system is used for low voltage signals. Contacts are crimped and gold-plated, with a combination of 1.27mm (0.050in) and 0.254mm (0.100in) spacing. The interconnect is housed in a straight board mount receptacle for easy assembly.
Developed originally for ITT’s aerospace customers, the mixed signal HV MDM connector is suitable for avionics and other aircraft systems, radar applications and launch vehicle systems.

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