Soldering pastes & materials

Indium Corporation will feature its Indium8.9HF Solder Paste at Productronica India, September 25-27, in Greater Noida, Delhi National Capital Region, India. Indium8.9HF is a proven solder paste series that delivers no-clean, halogen-free solutions designed to produce low-voiding, enhanced electrical reliability, and improved stability during the printing process. Under optimal process conditions, Indium8.9HF: • Demonstrates consistent […]

Indium Corporation has released IndiOx™ (In2O3) for use in the manufacture of ITO sputtering targets for thin-film coating. IndiOx™ (In2O3) is a stable ceramic-like material that is insoluble in water and volatizes at 850°C. When doped with tin oxide, IndiOx™ forms ITO, the material of choice to form transparent conductive oxide (TCO) layers in flat-panel […]

Indium Corporation will feature its LV1000 flux-coated solder preforms for 5G infrastructure at the 52nd International Symposium on Electronics (IMAPS) Boston, September 30–October 3, in Boston, Massachusetts. Indium Corporation’s LV1000 answers the demands of 5G wireless infrastructure by delivering superior reliability and performance. LV1000 produces lower voiding as compared to conventional solders, especially for bottom […]

Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for low-temperature assembly processes using indium and bismuth alloys. Indium 5.7LT-1 is engineered with a balanced set of properties for outstanding printing and soldering, including: Low-temperature reflow […]

Indium Corporation will feature its proven solder paste for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at Advanced System in Package (SiP) Technology Conference & Exhibition, June 25-27 in Monterey, California. Indium Corporation’s Indium3.2HF Solder Paste meets current and evolving challenges encountered in fine-pitch Heterogeneous Integration and SiP applications. Indium3.2HF delivers: Consistent printing […]

The cleaning agents of the VIGON PE Series for Power Electronics have been successfully established in the market and are qualified by leading power module manufacturers. Each cleaning agent provides excellent cleaning performance and reliably removes flux residues from power modules/DCBs after die attach or heat sink soldering. The cleaning agents ensure optimal copper deoxidation, […]

As in the past years the Hessian flux manufacturer will introduce a new flux at the SMTconnect 2019. As part of the expending development of its product range, Emil Otto will present the alcohol-based fluxing agent EO-B-013, which has been developed especially for power electronics, to the specialised audience. EO-B-013 is a multiflux with main […]

Advanced driver assistance systems (ADAS) are installed in housings of varying sizes and diverse plastic materials. Effective venting of the sensitive electronics combined with protection against external influences requires specific membranes: Schreiner ProTech offers an extensive portfolio of pressure compensation seals (PCS), which are either self-adhesive or welded to the housing using ultrasonic technology. Anytime […]

This is the only film in the world that can measure pressure. Pressure and pressure distribution, which could not be visually observed in the past, can now be easily confirmed. Prescale allows you to easily measure pressure balance, distribution, and size. Created using Fujifilm’s advanced thin film coating technologies, the pressure inspection sensor on the […]

Electronic components are becoming smaller and more complex. Miniaturisation brings with it complexities when protecting sensitive assemblies from external influences. Altus a leading distributor of capital equipment for the electronics assembly industry in the UK and Ireland, is addressing this concern with the help of its pre-eminent supplier, Rehm Thermal Systems. As components reduce in […]