Soldering pastes & materials

MicroCare Europe will showcase its newest electronics cleaning products at the SMT Hybrid Packaging Show in Nuremberg, Germany. The expo runs from 5-7 June 2018. These new circuit cleaners will help companies boost quality, enhance throughput and lower PCB production costs. They also will help clients meet ever-more stringent European regulations Amongst the new range […]

As one of the worldwide market leaders in the field of testing, programming, Long‑Term Conservation and -Storage, analytics as well as processing of electronic components the HTV-group of companies will present a variety from its wide range of partly unique services in hall 4, booth 460 at SMT 2018: NEW: Rework of printed circuit boards […]

Void formation under components with large soldering planes and low stand-off heights, such as QFN components, is a well-known phenomenon. The use of this type of components is on the rise, giving many designers, SMD line operators and quality control staff ever growing headaches to meet IPC criteria. This article focuses on a novel approach […]

Although, the OSP finish possesses some very interesting properties, it is seen by many as a low cost solution for low cost electronics. The main reason for this is that the solderability of the OSP coating degrades quite quickly after a lead-free reflow process. This can result in problematic through hole wetting in wave and […]

Current lead-free soldering temperatures can damage temperature sensitive components. Moreover they can cause a shift in the properties of some components which can impact the functionality of sensitive electronic devices. An easy way to solve this problem is to use a soldering alloy with a lower melting point that allows for lower soldering temperatures. Currently […]

Removing contamination from printed circuit boards remains a huge reliability and warranty issue for PCB manufacturers. One of the cleaning experts from MicroCare Corp., the industry’s leading manufacturer of critical cleaning products, addressed that specific issue at the Texas Cleaning and Reliability Workshops in Austin and Dallas on Oct. 23rd and 25th, 2017. Russell Claybrook, […]

For almost 2 decades, the Topklean EL 20 product range from Inventec Performance Chemicals (Inventec) has been the best in class co-solvent agent to be used mixed or separated with HFEs (hydrofluoroether) in vapour phase cleaning systems to remove solder flux residues, before application of conformal coatings, underfills or wire bonding process. The cleaning action […]

Inventec presents a new ultra low voiding formula, Ecorel Free 305-16LVD to achieve optimal voiding performance in automotive, power electronics, LED lighting and other high reliability applications, without degradation of high speed printability and chemical reliability. Solder voiding is a complex phenomenon under the combination of many interactions affecting both the reliability and quality of […]

German flux manufacturer Emil Otto GmbH continues to expand its product portfolio and brings an additional flux to market with the new alcohol-water-based flux EO-Y-004, which is also obtainable as a granulate-based concentrate.

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, will be exhibiting its latest range of product solutions, alongside its sister company MacDermid Enthone Electronics Solutions, at the productronica exhibition in Munich, Germany from Tuesday 14th – Friday 17th November. Alpha will present its latest stencils innovation, ALPHA® tensoRED® […]