Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications. Indium6.6HF exhibits superior wetting to a variety of surface finishes resulting in the fewest voids, a reduction […]
READ MOREIndium Corporation will observe the 15th anniversary of its “Live@APEX” program in 2019, featuring its proven products live on the show floor throughout IPC APEX Expo from Jan. 29-31 in San Diego, California, USA. Launched in 2004, Live@APEX is a joint effort between Indium Corporation and its industry partners. By demonstrating Indium Corporation products on […]
READ MOREIndium Corporation’s Donna Vareha-Walsh, Director, Metals Business Unit, shared her industry knowledge and expertise at the 2018 Global Minor Metals Forum on Nov. 28 in Kunming, Yunnan, China. Vareha-Walsh’s presentation, Indium Corporation Overview Global Indium Market, reviewed global indium supply and demand, how changes in trade between China and the United States are expected to […]
READ MOREIndium Corporation will feature its precision gold alloy solder preforms at the SPIE Photonics West event, February 2-7, in San Francisco, Calif. Indium Corporation’s AuSn preforms have the highest tensile strength of any solder, ensuring high-reliability joining and sealing. AuSn preforms are designed for high-reliability applications, such as laser, photonics, microwave systems, medical, and aerospace. […]
READ MOREHandling specialist Afag is expanding its range of proven spindle booms (SA) to include the more powerful modules of the FL series. The new components are significantly stronger than the standard booms from the Afag handling construction kit while retaining the same module geometry. This is made possible by a smaller spindle pitch.
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