Soldering pastes & materials

This is the only film in the world that can measure pressure. Pressure and pressure distribution, which could not be visually observed in the past, can now be easily confirmed. Prescale allows you to easily measure pressure balance, distribution, and size. Created using Fujifilm’s advanced thin film coating technologies, the pressure inspection sensor on the […]

Indium Corporation has released m2TIMTM — a new unique solid/liquid hybrid thermal interface material designed to provide ultra-reliable thermal conductivity for heat dissipation. Indium Corporation’s m2TIMTM combines liquid metal with a solid metal preform. The presence of a solid solder preform absorbs and contains the liquid alloys while improving thermal conductivity. Other m2TIMTM benefits include: […]

Würth Elektronik eiSos supplements its SMT spacers with plastic accessories

Hall 4 Booth 531

Indium Corporation will feature its void-reducing Indium8.9HF Solder Paste series to help customers Avoid the Void® at SMTconnect, May 7-9, in Nuremberg, Germany. The Indium8.9HF series is a proven product that delivers no-clean, halogen-free solder paste solutions designed to produce low-voiding—plus enhanced electrical reliability and improved stability—during the printing process. Under optimal process conditions, this […]

Indium Corporation has launched InFORMS® ESM02, a reinforced matrixed solder composite specifically designed to produce consistent bondline thickness for die-level attach applications. Indium Corporation’s InFORMS® ESM02 is a reinforced solder fabrication that produces a high-reliability solder joint with increased thermal and mechanical performance. Until recently, InFORMS® technology was only applied at the baseplate level. New […]

Indium Corporation has released Indium6.6HF Solder Paste – a new water-soluble solder paste that is compatible with both SnPb and Pb-free alloys. Indium6.6HF is designed to provide exceptional stencil printing performance and minimize voiding in PCB assembly applications. Indium6.6HF exhibits superior wetting to a variety of surface finishes resulting in the fewest voids, a reduction […]

Stand #J145

Includes a dedicated 3D Printing area on the Farnell element14 website and comprehensive series of webinars

Indium Corporation will observe the 15th anniversary of its “Live@APEX” program in 2019, featuring its proven products live on the show floor throughout IPC APEX Expo from Jan. 29-31 in San Diego, California, USA. Launched in 2004, Live@APEX is a joint effort between Indium Corporation and its industry partners. By demonstrating Indium Corporation products on […]