SMT Technology

10 years ago Eutect GmbH developed the world’s first and so travel only force-controlled wire feeder, the SWF. The SWF is used in particular in the field of laser soldering. In the context of the 10th anniversary, the SWF has been refined once again.

As manufacturers look towards improving production processes, Altus Group, a leading distributor of capital equipment in the UK and Ireland, is seeing a growing interest in big data solutions that provide predictive analytics. Investment in SMART technology is evident in all industries and was particularly apparent during Altus’ attendance of the What’s New in Electronics […]

Free downloadable guide features expert advice on 3D printing, building a component inventory, workshop safety and more

Indium Corporation will feature its high-reliability precision AuSn Solder Preforms at the 48th NEPCON Japan, Jan. 16-18 in Tokyo, Japan.

Myself and the other founders of ALL Circuits, started our adventure together with a very clear mission – to save the 400 jobs at the former Valeo, then Jabil factory in Meung sur-Loire just south of Paris. The facility had been inaugurated by Valeo in 1992 and acquired by Jabil ten years later. By 2009 […]

Indium Corporation will feature its ultra-reliable Indium8.9HF Solder Paste series at IPC APEX EXPO 2019, Jan. 29-31, in San Diego, California, USA.

Mouser Electronics, Inc. the New Product Introduction (NPI) leader empowering innovation, is pleased to announce a new partnership with SamacSys, a global leader in electronic component library solutions. Under the new partnership, announced today at electronica 2018 in Munich, Mouser will provide its customers with a range of free design resources including PCB footprints, schematic […]

XJTAG, a world leading supplier of JTAG boundary-scan hardware and software solutions, and high-quality technical support, announces significant updates with XJTAG v3.8. Waveform Viewer is now available in XJDeveloper, enhancing the user experience; the layout viewer is entirely replaced, and test coverage analysis algorithms have been improved. This latest version offers smarter debugging, a smoother […]

Indium Corporation will feature its proven soldering materials for Heterogeneous Integration & Assembly (HIA) and system-in-package (SiP) applications at the ELEXCON 2018, December 20-22 in Shenzhen, China. Indium Corporation’s soldering materials for HIA and SiP applications have a proven track record with more than 2 billon front-end module SiP devices manufactured in the last three […]

ZESTRON Europe, the leading supplier of cleaning products, cleaning process solutions and analytical services in the electronics industry, is expanding its portfolio with the stencil cleaner VIGON® TC 150. In addition to the typical stencil cleaning agents for removing solder pastes and adhesives, a water-based MPC® cleaner, which was developed especially for the removal of […]