SMT Technology

MicroCare Europe will showcase its newest electronics cleaning products at the SMT Hybrid Packaging Show in Nuremberg, Germany. The expo runs from 5-7 June 2018. These new circuit cleaners will help companies boost quality, enhance throughput and lower PCB production costs. They also will help clients meet ever-more stringent European regulations Amongst the new range […]

The Bantam Tools Desktop PCB Milling Machine is now available globally through Digi-Key Electronics, a global electronic components distributor, as the result of a new exclusive distribution agreement between the two companies. The Bantam Tools Desktop PCB Milling Machine delivers professional reliability and precision at an affordable price. Milling directly from Gerber files, the Bantam […]

As one of the worldwide market leaders in the field of testing, programming, Long‑Term Conservation and -Storage, analytics as well as processing of electronic components the HTV-group of companies will present a variety from its wide range of partly unique services in hall 4, booth 460 at SMT 2018: NEW: Rework of printed circuit boards […]

As one of the few European companies the HTV subsidiary MAF offers the Packaging or Housing of electronic components. Besides the sample production of Premold packages and Ceramic packages or the packaging of mass production quantities in standard plastic packages special packages for specific applications, for example, also with several Dice or in transparent packages, […]

Produce efficiently with ViCON

Void formation under components with large soldering planes and low stand-off heights, such as QFN components, is a well-known phenomenon. The use of this type of components is on the rise, giving many designers, SMD line operators and quality control staff ever growing headaches to meet IPC criteria. This article focuses on a novel approach […]

X-in-Board technology enables embedding of special technologies (inlays) in standard PCBs

Omron introduced a series of new 3D Automated Inspection products to the professional public this year in Munich at the leading European trade show. The company presented the global release of their latest 3D-AXI system utilising Computed Tomography (CT), claiming to be the world’s fastest CT X-ray inspection system. Conventional AXI methods are no longer sufficient to detect hidden solder defects, for instance HiP and voids under BGA or LGA devices and Barrel Fill in THT Connectors. X-Ray Inspection Systems (AXI) enables these hidden solder points to be tested with minimal time expenditure. However, with the new VT-X750, Omron has once again raised the bar for cycle time and High Capability Solder Joint Inspection.

Although, the OSP finish possesses some very interesting properties, it is seen by many as a low cost solution for low cost electronics. The main reason for this is that the solderability of the OSP coating degrades quite quickly after a lead-free reflow process. This can result in problematic through hole wetting in wave and […]

SEICA AUTOMATION was founded to fulfill customer needs of handling systems for the electronic production. The company can supply every kind of automation systems to complete production lines, from the easiest to the most elaborate ones. Thanks to its engineering department, which uses themost advances tools for development and 3D design,SEICA AUTOMATION can offer high […]