Vishay Intertechnology T55 Series of Polymer Tantalum Chip Capacitors Now Available in Z Case (EIA 7343-19) Size

6 FEBRUARY 2019

With Lower Profile Than Standard V Case, Devices Increase Package Density and Enable Design of Thinner End Products

Vishay Intertechnology, Inc. today announced that the company has extended its T55 series of vPolyTan™ surface-mount polymer tantalum molded chip capacitors with new devices in the Z case (EIA 7343-19) size.

With a 0.1 mm lower height than devices in the standard V case (EIA 7343-20), the Vishay Polytech capacitors released today increase package density and enable the design of thinner end products. The devices are optimized for power management, battery decoupling, and energy storage in computers, servers, network infrastructure equipment, solid-state drives, and wireless transceivers.

Offered in the compact J, P, A, B, T (low-profile B — 1.2 mm max), D, V, and Z case sizes, the T55 series features a wide capacitance range from 3.3 µF to 680 µF over voltage ratings from 2.5 V to 63 V, and a capacitance tolerance of ± 20 %. The capacitors provide ultra low ESR from 500 mΩ down to 7 mΩ at +25 °C, a result of their polymer cathodes, which offer greatly enhanced performance over manganese dioxide devices. Capacitance values up to 1000 µF and ESR values down to 6 mΩ are in development.

Operating over a temperature range of -55 °C to +105 °C, the capacitors offer excellent ripple current rating up to 5.66 A IRMS and provide low internal resistance for enhanced charge and discharge characteristics. Featuring lead (Pb)-free terminations, the T55 series is RoHS-compliant, halogen-free, and Vishay Green. The devices are compatible with high volume automatic pick and place equipment and offer a Moisture Sensitivity Level (MSL) of 3.

Samples and production quantities of the T55 series capacitors in the Z case size are available now, with lead times of 12 to 14 weeks.

Vishay Intertechnology | www.vishay.com

Leave a Reply

Your email address will not be published. Required fields are marked *

  • We use your personal data ONLY to respond to your comments/requests.
  • To receive responses that are appropriate to your requests, we may transfer your email address and your name to the author of the article.
  • For more information on our Privacy Policy and Personal Data Processing, please visit the page: Privacy Policy (GDPR) & Cookies.
  • If you have any questions or concerns regarding the way we process your personal data, you can contact our Data Protection Officer at: gdpr@esp2000.ro
  • Subscribe to our magazine newsletter