Indium Corporation to Feature Low-Voiding Solder Pastes at SMTA International 2018

4 SEPTEMBER 2018

Indium Corporation will feature its suite of void-reducing, no-clean solder pastes to help customers Avoid the Void® at SMTA International from Oct. 14-18 in Rosemont, Illinois.

Indium Corporation’s suite of solder pastes, including Indium8.9HF and Indium10.1, are specially formulated to deliver ultra low-voiding, plus enhanced benefits such as improved response-to-pause, stability, head-in-pillow (HIP) minimization, reliable in-circuit testing, and enhanced SIR performance.

Indium Corporation’s versatile high-performance solder pastes are designed to accommodate a variety of processing temperatures and industry requirements with lead-free, halogen-free, no-clean options.

For more information about Indium Corporation’s suite of low-voiding solder pastes, visit www.indium.com/avoidthevoid or find us at booth #523.

Indium Corporation is a premier materials manufacturer and supplier to the global electronics, semiconductor, thin-film, and thermal management markets. Products include solders and fluxes; brazes; thermal interface materials; sputtering targets; indium, gallium, germanium, and tin metals and inorganic compounds; and NanoFoil®. Founded in 1934, the company has global technical support and factories located in China, Malaysia, Singapore, South Korea, the United Kingdom, and the USA.

Indium Corporation | www.indium.com

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