- Improved mechanical and thermal reliability
- Uniform bondline thickness
- Low-voiding performance
InFORMS® do more than just bond two surfaces.
These solder preforms are designed to address some specific challenges to the power electronics industry.
InFORMS® provide engineers with an enhanced material for the development of more reliable and higher performance modules. Due to the planarity improvements and stand-off tolerances, the package design becomes more predictable. In addition, stronger and more dependable joints allow for high power densities.
For more information about InFORMS®, visit www.indium.com/informs or visit us at booth #722.
Indium Corporation | www.indium.com