Packaging of electronic components „Made in Germany“

10 APRIL 2018

As one of the few European companies the HTV subsidiary MAF offers the Packaging or Housing of electronic components.

Besides the sample production of Premold packages and Ceramic packages or the packaging of mass production quantities in standard plastic packages special packages for specific applications, for example, also with several Dice or in transparent packages, can be developed and produced as well.

Products and Services at a glance:

  • Wafer Cutting / Dicing
  • Chips in Waffle Pack
  • Chip Bonding and Wire Bonding
  • Packaging / Housing of integrated circuits
    • Standard packages (i. a. SOP, SSOP, QFP, FOQ, FOD)
    • Special packages
  • Laser Marking
  • Electrical Tests and Lead Inspection
  • Packing: Tray, Tube, Reel
  • COB (Chip on Board) Mounting for sample quantities
  • Quality Inspections
  • ASIC Development

MAF Microelectronic Assembly Frankfurt (Oder) GmbH   |    www.maf-ffo.de

Leave a Reply

Your email address will not be published. Required fields are marked *

  • We use your personal data ONLY to respond to your comments/requests.
  • To receive responses that are appropriate to your requests, we may transfer your email address and your name to the author of the article.
  • For more information on our Privacy Policy and Personal Data Processing, please visit the page: Privacy Policy (GDPR) & Cookies.
  • If you have any questions or concerns regarding the way we process your personal data, you can contact our Data Protection Officer at: gdpr@esp2000.ro
  • Subscribe to our magazine newsletter