Renesas Electronics Highlights Innovative Connectivity Solutions Enabling Smart Society at embedded world 2018

16 FEBRUARY 2018

Visit Stand 310, Hall 1 for the latest Renesas Technology Demonstrations for Automotive AI, Factory Automation, Healthcare, Cloud Connectivity and More Special Guest on Renesas Stand: Nick Heidfeld, Racing Driver of Mahindra Racing Formula E Team Sponsored by Renesas

Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, today announced it will showcase its embedded semiconductor expertise at Stand 310, Hall 1 of this year’s embedded world, February 27 to March 1, 2018, Nuremberg, Germany. Demonstrations will highlight the company’s connectivity solutions designed to enable a Smart Society. These include demonstrations for automotive AI, factory automation, healthcare, cloud connectivity, and more. Renesas is also proud to present Nick Heidfeld, racing driver of the Mahindra Racing Formula E Team, as special guest on the VIP stage programme.

VIP stage programme
Renesas, the official technical partner of the Mahindra Racing Formula E Team, is proud to welcome the team driver and German national, Nick ‘Quick Nick’ Heidfeld on Tuesday, February 27 on the VIP stage programme.

Date/Time: Tuesday, February 27, 1:30 to 2:00 PM
Location: Passage between Halls 3A and 4A

After the VIP stage programme, ‘Quick Nick’ will be signing autographs at the Renesas booth at 2:30 PM.

Renesas Product and Technology Demonstrations

AI connected car simulator – the future of driving
As part of Renesas’ open, innovative, and trusted Renesas autonomy™ Platform for ADAS and automated driving, Renesas will be showcasing its connected car simulator incorporating a new development kit based on cocoro SB’s emotion engine. Renesas automotive demos illustrate a range of end-to-end services that support drivers’ safety and security while anticipating their needs.

Connectivity solutions to enhance factory automation and healthcare applications, smart factory networks, and home appliances
Renesas will showcase for factory automation and networking it’s Intelligent IE Modules solution kit and an end-node application featuring OPC-UA pub-sub with TSN on the RZ/N1 development board. Renesas will also show its G3-PLC home appliance solutions for light control, load detection and energy measurement, as well as advanced networking solutions for home and building automation (VoPLC, DALI GW).

Secure MCUs for a connected world
Renesas will be showing a wealth of cloud connectivity and HMI solutions including the latest RL78, RX, RZ and Renesas Synergy developments as well as power supply solutions. Visitors can try out the PowerCompass™ app to quickly identify the right power solution for their application and generate a custom reference design file in a few minutes.

MCU Car Rally
Renesas will also be holding its popular European MCU Car Rally for the fourth year running as platinum sponsor of the embedded world students’ day. Student teams from all over Europe were tasked with building a model racing car with Renesas components and will race them in the rally, which is being held in the main entrance area (Mitte) on March 1st, the third day of the show.

Renesas Electronics Corporation   |


(Remarks) Formula 1 is a trademark of Formula One Licensing B.V. Renesas Synergy and PowerCompass are trademarks of Renesas Electronics Corporation. All names of products or services mentioned in this press release are trademarks or registered trademarks of their respective owners.


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