Inventec introduces two new lead free solder paste formulas

17 OCTOBER 2017

Inventec presents a new ultra low voiding formula, Ecorel Free 305-16LVD to achieve optimal voiding performance in automotive, power electronics, LED lighting and other high reliability applications, without degradation of high speed printability and chemical reliability. Solder voiding is a complex phenomenon under the combination of many interactions affecting both the reliability and quality of solder joints, in such interactions solder paste is a key contributor.

Ecorel Free 305-16LVD is a No Clean, lead free solder paste developed to achieve ultra low voiding and reduce the size of voids, especially in large area components such as power discretes, LEDs and QFNs. It is a halogen free ROL0 flux system; available is powder size type 3 and 4. It has been recently selected to be used in new generation electronics modules for a global German automotive OEM.

The main benefits of Ecorel Free 305-16LVD include:

  • Ultra low voiding percentage and reduced void size
  • Very good wetting on any surface finish
  • Transparent colourless residue
  • Good first pass yield pin testability
  • It can be processed under air or nitrogen reflow atmospheres

Ecorel Free 305-16LVD is available worldwide in different packaging options.

Inventec presents its new products at productronica 2017, hall A1, booth 417.

Inventec  |   www.inventec.dehon.com

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