Editorial by Cornel Pazara

9 MAY 2017

CP_Editorial-1Electronica Azi International had a very successful launch at Embedded world where over 70 countries were represented and more than 540 exhibitors displayed their latest electronics enabling a more connected world. Over 30,000 visitors walked the show’s halls and visited the various booths and attended the many conferences. At the embedded conferences, new ideas were introduced such: the introduction of multicore processors in embedded applications, advances of new microcomputer architectures, new wireless communication standards and the introduction of new programming languages and technologies. Also, another key theme was highlighted in many presentations and at many of the booths: functional safety plus protection against attacks on embedded systems.
So, as the buzz of that exhibition fades, we look toward the next big event, the PCIM, which will highlight the latest in Power Management IC’s and is scheduled for May 16th – 18th in Nuremberg, Germany.

The PCIM has grown every year both in number of attendees, as well as the, number of exhibitors that display their latest offering or present at the very informative conferences. In previous years, some of the key announcements in power management innovations have been announced at this show and we expect the same this year. New materials for semiconductor devices including wide bandgap power electronics, reliability issues for power modules and advanced systems, as well as, design regulations to manage ultrafast switching devices in the circuit form the backbone of the PCIM 2017. Other subjects that will be covered range from advanced technologies for power semiconductor devices, such as Gallium Nitride and Silicon Carbide, and passive components which control and drive strategies for high efficiency, high power density converters focused on automotive, industrial, wireless devices and renewable energy technologies.

We invite you to join us in the SMT Hybrid Packaging area at booth H5-114. Also, some of our key customers that we cover in our publication will also be there. Please make sure to stop by their respective booths; Vicor H9-537, Ericsson Power Modules H9-242 , Microchip H9-525 and LEM H9-204.

Cornel Pazara
Contributing Editor

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